Fabrication Backend Process Engineer

Job Description

Job Title: Fabrication Backend Process Engineer, Quantum AI. Location: Goleta, California, USA

Responsibilities:

• Collaborate with design, test, frontend, and packaging teams to integrate new backend modules into quantum devices.

• Develop and refine device probing, packaging, and measurement methodologies to support successful product delivery and customer satisfaction.

• Lead the development and maintenance of die singulation, die preparation, device hybridization, and device characterization processes.

• Operate and maintain associated equipment to achieve optimal process outcomes;

• Troubleshoot process and equipment issues promptly to minimize downtime and maintain production goals.

• Design, build, and maintain backend process infrastructure to improve efficiency, organization, and scalability.

• Establish standardized work practices and optimize workflows for streamlined operations.

• Analyze process data to identify trends, improve process stability, and drive continuous yield improvement.

• Develop scalable bonding and die preparation processes that meet quality standards.

• Qualify equipment and processes to establish and maintain advanced packaging techniques.

• Collaborate with cross-functional teams to improve device performance, manufacturing yield, and reliability.

Qualifications:

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a related specialized field, such as Optics, Sensors, or Audio/Digital Signal Processing, or equivalent practical experience.

• At least 1 year of experience working in a wafer-level or die-level cleanroom environment.
• At least 1 year of experience in one or more of the following areas:
  • Statistical process control (SPC).
  • Electrical testing and probing.
  • Metrology techniques, including SEM, XPS, and interferometry.
  • Failure analysis.

• At least 1 year of experience with hybridization techniques, including flip-chip bonding, die handling, and post-bonding measurements.

Preferred:

• Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field, such as Optics, Sensors, or Audio/Digital Signal Processing.

• Experience developing novel bump materials, scaling up die sizes, performing flip-chip bonding, or designing structural bonding solutions.
• Experience with characterization techniques, including:
  • Scanning electron microscopy (SEM).
  • X-ray photoelectron spectroscopy (XPS).
  • Confocal microscopy.
  • Interferometry.

• Experience with statistical process control and failure analysis.

• Experience using data analysis and visualization tools such as JMP, Python, or SQL.

Benefits and Compensation:

• Salary: $108,000 to $153,000 per year.

• Annual bonus: 15% target bonus.

• Equity: Potential equity grants, subject to company discretion, approval, and applicable grant agreements.

• Additional benefits: Google employee benefits. Details are available on the Google Careers benefits page.

Individual compensation depends on job-related skills, experience, education, and training.

Other Information:

• Company: Google Quantum AI.

• Work environment: Quantum processor fabrication, manufacturing, and advanced device packaging.

• Language requirement: English proficiency is required for this role.

• Equal opportunity: Google is an equal opportunity and affirmative action employer committed to workplace diversity, inclusion, and accessibility.

• Accommodations: Applicants who require accommodations can submit a request through Google's Applicant Accommodations Form;

• Recruitment agencies: Google does not accept unsolicited agency resumes and is not responsible for fees associated with them.

• Applicant privacy: Applications and profile information are subject to Google's Applicant and Candidate Privacy Policy.