Fabrication Support Engineer, AWS CQC

Job Description

Job Title: Fabrication Support Engineer, AWS CQC - Fabrication. Location: Pasadena, CA, USA

Responsibilities:

• Lead the sustainment and development of die singulation, die preparation, and device probing processes.
• Support wirebonding and flip-chip bonding activities.
• Operate and maintain semiconductor and IC packaging equipment.
• Troubleshoot process and equipment issues to minimize downtime and maintain production goals.
• Design, build, and maintain backend process infrastructure to improve efficiency, organization, and scalability.
• Implement standardized work practices and optimize fabrication and packaging workflows;
• Analyze process data to identify trends, improve process stability, and drive continuous yield improvement.
• Perform hands-on packaging tasks in a cleanroom environment while wearing protective equipment.
• Carry out packaging processes for quantum computing product chips and development projects.
• Work independently during the assigned late-afternoon and late-night schedule after completing daytime training.

Qualifications:

• At least 2 years of technical support experience.
• At least 2 years of direct microfabrication experience.
• At least 2 years of hands-on experience with wafer-level and die-level handling, die cleaning, and optical inspection equipment.
• Excellent communication and writing skills.

Preferred:

• At least 2 years of experience with one or more of the following:
  • Saw dicing
  • Electrical testing and probing
  • Wirebonding
  • Flip-chip bonding
• At least 2 years of microfabrication experience in a research and development environment.
• Experience developing new processes and performing failure analysis.
• Experience with data analysis and visualization tools.
• Experience with inventory management and Manufacturing Execution Systems (MES).

Benefits and Compensation:

• Base salary: $74,700 to $130,700 per year.
• Sign-on payments and restricted stock units (RSUs) may be included in the compensation package.
• Health insurance, including medical, dental, vision, and prescription coverage.
• Basic Life and AD&D insurance, with supplemental life insurance options.
• Employee Assistance Program and mental health support;
• Medical advice line and flexible spending accounts.
• Adoption and surrogacy reimbursement coverage.
• 401(k) matching.
• Paid time off.
• Parental leave.

Work Schedule and Environment:

• Typical schedule is approximately 4:00 PM to 1:00 AM.
• Initial training is conducted during daytime hours.
• After training, the employee is expected to work independently during the assigned shift.
• Most work takes place in a cleanroom environment.
• The role involves hands-on work with IC packaging equipment and quantum computing chips.

Other Information:

• The position is part of the AWS Center for Quantum Computing fabrication and packaging team in Pasadena.
• The team develops and delivers quantum computing product chips and works on long-term quantum computing challenges.
• Due to export control requirements, candidates must meet applicable U.S. eligibility requirements or be able to obtain a U.S. export license.
• Amazon encourages candidates with diverse career paths and experiences to apply;
• Amazon provides mentorship, knowledge-sharing, training, and career-development resources.
• Workplace accommodations are available for candidates who need them during the hiring process.