Associate Optical Packaging Engineer

Job Description

Job Title: Associate Optical Packaging Engineer. Location: Milpitas, California, United States

Job Type: Full-Time, Entry Level, Onsite

Responsibilities:

  • Build fiber-to-chip optical packages and photonic chip assemblies in a hands-on manufacturing environment
  • Support development and optimization of optical packaging and active alignment processes for photonic components
  • Assist in process characterization including optical alignment, adhesive curing, and performance evaluation
  • Conduct experiments and collect data to improve optical coupling efficiency, yield, and process stability;
  • Support New Product Introduction (NPI) activities including process development and production readiness
  • Troubleshoot manufacturing and reliability issues using structured problem-solving methods
  • Develop and maintain process documentation including work instructions, process flows, and control plans
  • Collaborate with design, manufacturing, test, and reliability teams on packaging improvements
  • Support equipment setup, calibration, qualification, and maintenance for optical assembly systems
  • Work with vendors and internal teams to evaluate materials and tooling improvements;
  • Analyze metrology and process data to identify yield and quality improvement opportunities

Qualifications:

  • Bachelor’s or Master’s degree in Engineering, Physics, Materials Science, or related field
  • 1–3 years of experience in semiconductor packaging, photonics, optics, or advanced manufacturing (internships included)
  • Understanding of optical alignment, fiber optics, and optical measurement techniques
  • Experience with precision assembly systems or semiconductor manufacturing tools;
  • Hands-on lab or manufacturing experience with metrology and assembly processes
  • Strong communication and collaboration skills
  • Problem-solving ability in fast-paced engineering environments

Preferred:

  • Familiarity with photonic integrated circuit (PIC) packaging or optical module assembly
  • Experience with data analysis tools such as Excel, MATLAB, JMP, or Python;
  • Understanding of statistical process control (SPC), DOE, or yield analysis concepts
  • Exposure to automated manufacturing or semiconductor assembly systems

Benefits and Compensation:

  • Base salary range: $85,000 to $120,000 (U.S.), or $115,000 to $130,000 (Bay Area) depending on experience
  • Equity eligibility as part of total compensation package
  • Comprehensive employee benefits (healthcare, medical, dental, vision, and mental health support)
  • Opportunity to work on large-scale fault-tolerant photonic quantum computing systems;
  • Exposure to advanced semiconductor manufacturing and optical packaging technologies
  • Career growth in a cutting-edge quantum hardware environment

Other Information:

  • PsiQuantum focuses on building large-scale, fault-tolerant quantum computers using silicon photonics
  • Role involves hands-on engineering and lab-based work in optical packaging and assembly
  • Candidates must complete application requirements including cover letter and eligibility questions
  • Equal employment opportunity employer committed to diversity and inclusion;
  • Applicants are advised to apply only through official PsiQuantum channels

JOB TYPE

Entry Level

COMPENSATION

$85k - $130k

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