Job Description
Job Title: Associate Optical Packaging Engineer. Location: Milpitas, California, United States
Job Type: Full-Time, Entry Level, Onsite
Responsibilities:
- Build fiber-to-chip optical packages and photonic chip assemblies in a hands-on manufacturing environment
- Support development and optimization of optical packaging and active alignment processes for photonic components
- Assist in process characterization including optical alignment, adhesive curing, and performance evaluation
- Conduct experiments and collect data to improve optical coupling efficiency, yield, and process stability;
- Support New Product Introduction (NPI) activities including process development and production readiness
- Troubleshoot manufacturing and reliability issues using structured problem-solving methods
- Develop and maintain process documentation including work instructions, process flows, and control plans
- Collaborate with design, manufacturing, test, and reliability teams on packaging improvements
- Support equipment setup, calibration, qualification, and maintenance for optical assembly systems
- Work with vendors and internal teams to evaluate materials and tooling improvements;
- Analyze metrology and process data to identify yield and quality improvement opportunities
Qualifications:
- Bachelor’s or Master’s degree in Engineering, Physics, Materials Science, or related field
- 1–3 years of experience in semiconductor packaging, photonics, optics, or advanced manufacturing (internships included)
- Understanding of optical alignment, fiber optics, and optical measurement techniques
- Experience with precision assembly systems or semiconductor manufacturing tools;
- Hands-on lab or manufacturing experience with metrology and assembly processes
- Strong communication and collaboration skills
- Problem-solving ability in fast-paced engineering environments
Preferred:
- Familiarity with photonic integrated circuit (PIC) packaging or optical module assembly
- Experience with data analysis tools such as Excel, MATLAB, JMP, or Python;
- Understanding of statistical process control (SPC), DOE, or yield analysis concepts
- Exposure to automated manufacturing or semiconductor assembly systems
Benefits and Compensation:
- Base salary range: $85,000 to $120,000 (U.S.), or $115,000 to $130,000 (Bay Area) depending on experience
- Equity eligibility as part of total compensation package
- Comprehensive employee benefits (healthcare, medical, dental, vision, and mental health support)
- Opportunity to work on large-scale fault-tolerant photonic quantum computing systems;
- Exposure to advanced semiconductor manufacturing and optical packaging technologies
- Career growth in a cutting-edge quantum hardware environment
Other Information:
- PsiQuantum focuses on building large-scale, fault-tolerant quantum computers using silicon photonics
- Role involves hands-on engineering and lab-based work in optical packaging and assembly
- Candidates must complete application requirements including cover letter and eligibility questions
- Equal employment opportunity employer committed to diversity and inclusion;
- Applicants are advised to apply only through official PsiQuantum channels
LOCATION
JOB TYPE
Entry LevelCOMPENSATION
$85k - $130k
SKILLS
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