Characterization Failure Analysis Engineer

Job Description

Job Title: Principal Characterization-Failure Analysis Engineer. Location: Milpitas, California, USA

Job Type: Full-Time, Senior Level (10+ years experience)

Responsibilities:

  • Perform thermomechanical characterization of sub-assemblies and silicon dies used in quantum systems
  • Conduct failure analysis and debugging of sub-assemblies using structured root cause methodologies
  • Apply tools such as fishbone diagrams, hypothesis tables, and 8D problem-solving methods
  • Perform Failure Mode and Effects Analysis (FMEA) to identify and mitigate risks
  • Analyze data using Python, MATLAB, and JMP for engineering insights;
  • Work with semiconductor assembly processes including die attach, wire bonding, and automated optical inspection (AOI)
  • Investigate photonics-based sub-assembly issues including optical coupling, flip chip integration, and underfill materials
  • Characterize system behavior under mechanical vibration, thermal stress, and mechanical loading
  • Manage tight deadlines and operate effectively in fast-paced engineering environments
  • Collaborate with cross-functional teams and provide technical leadership in ambiguous failure scenarios
  • Communicate findings clearly through written reports and technical presentations

Qualifications:

  • Master’s degree or higher in Electrical Engineering, Mechanical Engineering, Optical Engineering, or Applied Physics
  • 10+ years of experience in failure analysis and debugging of complex opto-mechanical or semiconductor systems
  • Strong expertise in mechanical, thermal, and packaging engineering disciplines
  • Experience with semiconductor assembly processes and inspection techniques;
  • Strong analytical and problem-solving skills
  • Excellent written and verbal communication skills
  • Ability to work independently and lead technical investigations

Preferred:

  • Experience with photonics sub-assembly systems
  • Background in optical coupling, cryogenic systems, or semiconductor packaging
  • Familiarity with advanced manufacturing inspection and testing systems
  • Ability to work in ambiguous and research-driven environments
  • Strong leadership capability in technical problem-solving

Benefits and Compensation:

  • Base salary range: $165,000 – $200,000 (US), up to $208,000 – $245,000 in Bay Area
  • Equity participation for full-time employees
  • Comprehensive benefits package (healthcare, insurance, retirement plans depending on company policy)
  • Opportunity to work on large-scale, utility-grade quantum computing systems;
  • Exposure to cutting-edge silicon photonics quantum architecture
  • Collaboration with leading global industry partners and research teams

Other Information:

  • Must be legally authorized to work in the United States (no visa sponsorship provided)
  • Role is part of PsiQuantum’s mission to build million-qubit fault-tolerant quantum systems
  • Work involves high-performance photonic quantum computing architecture;
  • Company operates in collaboration with major semiconductor manufacturing partners
  • Equal opportunity employer committed to diversity and inclusion
  • Candidates are advised to beware of recruitment scams using unofficial email domains

JOB TYPE

Full-time

COMPENSATION

$165k - $245k

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