Fabrication R&D Scientist

Job Description

Job Title: Fabrication R&D Scientist, Amazon Center for Quantum Computing. Location: Pasadena, CA, USA

Responsibilities:

• Develop and optimize fabrication processes for high-coherence superconducting qubits.
• Research and develop advanced 3D integration, interconnect, and routing technologies for superconducting quantum processors.
• Perform microfabrication and nanofabrication work within cleanroom environments.
• Analyze inline metrology measurements and electrical test data to improve fabrication processes;
• Develop and maintain process integration documentation, design rules, and standard operating procedures.
• Collaborate with project leads to continuously improve fabrication processes and manufacturing workflows.
• Stay current with advancements in semiconductor fabrication and quantum processor manufacturing technologies.
• Provide technical guidance and mentorship to junior scientists and engineers.
• Plan experiments, analyze results, and propose new fabrication technologies and process improvements.
• Collaborate with scientists, engineers, and technicians across multiple disciplines.

Qualifications:

• PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or an equivalent field.
• Demonstrated research experience in nanofabrication, MEMS, or 2.5D/3D semiconductor integration.
• Strong analytical, problem-solving, and scientific research skills;
• Experience managing multiple projects independently and within collaborative teams.
• Excellent verbal, written, and data presentation skills.

Preferred:

• Two or more years of experience in semiconductor process integration within a 200 mm or 300 mm foundry environment, preferably in research and development.
• Hands-on experience with:
  • Manufacturing execution systems (MES)
  • Electron beam lithography
  • Photolithography
  • Wet and dry wafer etching
  • Wafer cleaning and lift-off processes
  • Thin-film deposition and metrology
  • Electroplating
  • Wafer thinning
  • Chemical mechanical polishing (CMP)
  • Temporary and permanent wafer bonding
  • Flip-chip packaging
  • 2.5D and 3D integration technologies
• Familiarity with superconducting quantum computing components, fabrication methods, and packaging.
• Experience with failure analysis, root cause investigations, yield monitoring, and statistical process control.
• Proficiency in Python, Julia, MATLAB, or other scripting languages.
• Experience using statistical analysis and process optimization tools such as JMP or Minitab.

Benefits and Compensation:

• Annual base salary: $142,800 to $193,200 USD, depending on experience, qualifications, and location.
• Sign-on bonus and Restricted Stock Units (RSUs).
• Comprehensive health benefits including medical, dental, vision, prescription coverage, life insurance, employee assistance programs, mental health support, flexible spending accounts, and adoption and surrogacy reimbursement.
• 401(k) retirement plan with company matching.
• Paid time off and parental leave.
• Flexible work-life balance with flexible working hours.
• Ongoing mentorship, knowledge sharing, and career development opportunities.
• Inclusive and collaborative work environment focused on innovation and professional growth.

Other Information:

• Position is based in Pasadena, California.
• Candidates must satisfy U.S. export control requirements, including U.S. citizenship, permanent residency, refugee or asylum status, or eligibility to obtain a U.S. export license.
• Amazon encourages applications from candidates with diverse backgrounds and non-traditional career paths;
• Amazon is an equal opportunity employer committed to an inclusive workplace and does not discriminate based on protected characteristics.
• Workplace accommodations are available throughout the hiring and onboarding process for qualified applicants with disabilities.