Quantum Interposer Integration Engineer

Job Description

Job Title: Quantum Interposer Integration Engineer. Location: Yorktown Heights, NY, USA

Responsibilities:

• Integrate, optimize, and sustain end-to-end process flows for superconducting interposers and advanced wafer-level components.
• Collaborate with wafer-level manufacturing teams to refine and mature superconducting interposer wafer processes.
• Develop and refine post-process flows including deposition, etching, planarization, lithography, wafer dicing, and surface finishing.
• Select equipment and processes and guide their installation, qualification, and operation.
• Support and optimize wafer bonding technologies to meet electrical, mechanical, and cryogenic performance targets.
• Develop advanced processes for shaping and finishing interposer components for novel architectures and topologies;
• Perform process and yield modeling to identify bottlenecks, improve throughput, plan tool utilization, and increase manufacturing efficiency.
• Conduct hands-on characterization and structured experiments to evaluate process interactions and materials behavior.
• Work with metrology teams to define measurement plans, analyze data, and correlate process parameters with device performance and yield.
• Collaborate with design, packaging, and manufacturing engineers to ensure process compatibility and alignment with development and production milestones.
• Document process flows, integration strategies, equipment requirements, and troubleshooting methods.
• Communicate progress, risks, and technical findings to senior management.
• Coordinate activities across cross-functional engineering teams.

Qualifications:

• BS, MS, or PhD in Electrical Engineering, Physics, Chemistry, Materials Science, or a related field.
• 7+ years of relevant professional experience.
• Experience with silicon spin interposer technologies.
• Hands-on experience with semiconductor or advanced packaging manufacturing processes, including PVD/CVD deposition, etching, lithography, wafer bonding, and post-processing or finishing;
• Familiarity with bonding technologies such as indium bumping, gold thermocompression, solder-based interconnects, or direct bonding.
• Experience with process flow modeling, yield modeling, and manufacturing planning for throughput, downtime, and capital utilization.

Preferred:

• Strong analytical and problem-solving skills.
• Experience conducting structured experiments and interpreting complex datasets.
• Strong communication skills and experience working with senior leadership and cross-functional engineering teams.
• Proficiency with statistical analysis tools such as JMP.
• Experience with Design of Experiments (DOE) methodologies.
• Doctorate degree preferred.

Benefits and Compensation:

• Projected salary range: $200,000 to $250,000 per year.
• Healthcare benefits including medical, prescription, dental, vision, and mental health coverage.
• Financial programs including 401(k), cash balance pension plan, employee stock purchase plan, financial counseling, and life insurance.
• Short-term and long-term disability coverage.
• Performance-based salary incentive opportunities.
• Paid time off including 12 holidays, at least 56 hours of sick time, and 120 hours of vacation;
• 12 weeks of parental bonding leave and other paid care leave programs, subject to applicable policies and laws.
• Training and educational resources through IBM's AI-driven learning platform.
• Access to industry-recognized certifications and professional development opportunities.
• Employee resource groups, volunteer opportunities, and discounts on products and services.

Other Information:

• Work arrangement: On-site.
• Travel: Up to 20%, or approximately 1 day per week.
• Employment type: Regular;
• IBM will not provide visa sponsorship for this position now or in the future. Candidates must be able to work without current or future visa sponsorship.
• IBM is an equal opportunity employer and is committed to an inclusive workplace.
• The position is not commission-based.