Quantum Interposer Technologist

Job Description

Job Title: Quantum Interposer Technologist. Location: Yorktown Heights, NY, USA

Responsibilities:

• Serve as the primary technical expert for IBM's superconducting silicon spin interposer technology roadmap.
• Lead the development, fabrication, and refinement of silicon spin superconducting interposer manufacturing processes.
• Oversee wafer-level processing, finishing, multilayer integration, and advanced packaging.
• Design and improve end-to-end process stacks and interposer layouts for high-performance connectivity, interface stability, and cryogenic reliability.
• Direct manufacturing and characterization activities, including structured experiments, failure analysis, and root-cause investigations;
• Establish fabrication standards covering design rules, operational controls, reliability requirements, documentation, and continuous improvement.
• Work with internal design teams to align mask strategies, connectivity requirements, RF considerations, and cryogenic constraints throughout design reviews and tape-out.
• Provide technical leadership to external manufacturing partners and ensure alignment on superconducting materials, wafer processes, packaging specifications, and deep-cryogenic performance.
• Integrate cryogenic mechanical, thermal, and RF requirements into interposer architecture, manufacturing, and qualification processes;
• Lead long-term planning for interposer manufacturing, including facility requirements, organizational development, capital equipment strategy, and technology roadmaps.
• Resolve complex technical challenges through experimentation, quantitative analysis, and systematic root-cause methods.
• Apply Statistical Process Control (SPC) to improve manufacturing stability, reliability, and continuous improvement.
• Use data analysis, modeling, and Design of Experiments (DOE) to support technical decisions.
• Lead cross-functional engineering teams and communicate technical strategies to senior leadership.

Qualifications:

• Bachelor's degree required. A degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field is preferred.
• Expert-level understanding of silicon spin superconducting device fabrication, integration, and cryogenic system development.
• Demonstrated experience with facilities planning, capital equipment selection, fabrication line establishment, staffing strategies, and long-term technology roadmaps.
• Extensive experience with wafer fabrication, thin-film processes, multilayer wiring, superconducting materials, or semiconductor-class interposer research, development, and manufacturing;
• Expertise in RF design constraints, interposer parasitics, and deep-cryogenic performance requirements.
• Strong understanding of superconducting device behavior, materials interactions, interface engineering, and advanced packaging technologies.
• Strong communication skills and experience leading cross-functional engineering teams.
• Ability to present technical strategies to senior leadership.

Preferred:

• Master's or Doctorate degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field.
• Proven ability to solve complex technical problems using structured experimentation and quantitative analysis.
• Experience applying Statistical Process Control (SPC).
• Proficiency with data analysis, modeling, and Design of Experiments (DOE) tools.
• Experience developing and managing advanced quantum or semiconductor fabrication technologies.

Benefits and Compensation:

• Projected salary range: $300,000 to $360,000 per year.
• Healthcare coverage including medical, prescription, dental, vision, and mental health benefits.
• Financial programs including 401(k), cash balance pension plan, employee stock purchase plan, financial counseling, and life insurance.
• Short-term and long-term disability coverage.
• 12 paid holidays and at least 56 hours of sick time;
• 120 hours of vacation.
• Parental bonding leave and other paid family care leave programs.
• Training and educational resources through IBM's AI-driven learning platform.
• Employee resource groups, volunteer opportunities, and retail discounts.

Other Information:

• Work arrangement: On-site.
• Travel: Up to 20%, approximately one day per week.
• This is a regular, full-time position;
• IBM will not provide visa sponsorship now or in the future. Candidates must be able to work in the United States without current or future visa sponsorship.
• IBM is an equal opportunity employer and considers qualified applicants without regard to legally protected characteristics.
• The position was posted on October 7, 2026, and is expected to remain posted for 21 days or less if the position is filled earlier.