Staff Integration Engineer

Job Description

Job Title: Staff Integration Engineer. Location: Greater Albany, New York, USA

Responsibilities:

• Lead process development and integration of optical interposer modules, including photonic waveguide layers and precision optical coupling structures.
• Develop and qualify wafer-level processes for photonic and optoelectronic integration, covering alignment, bonding, and encapsulation to ensure optical performance and reliability.
• Define design rules, process assumptions, and wafer acceptance criteria for optical interposer and packaging modules.
• Drive co-design across photonic, electrical, and mechanical domains to optimize performance, manufacturability, and yield.
• Partner with foundry and packaging vendors to develop optical I/O solutions such as fiber attach and photonic–electronic co-packaging.
• Analyze inline metrology, optical loss measurements, and defect data to identify and resolve yield limiters;
• Establish process controls, statistical methods (Cp/Cpk), and reliability test protocols for new optical and packaging modules.
• Collaborate with multidisciplinary teams to support materials selection, tool evaluation, and computational modeling for next-generation optical integration schemes.
• Manage cross-functional development programs with external foundry and OSAT partners from R&D to pilot or production environments.

Qualifications:

• M.S. or Ph.D. in Electrical Engineering, Materials Science, Applied Physics, or a related field.
• 10+ years of experience in semiconductor or photonic process integration, optical packaging, or heterogeneous photonic integration.
• Proven experience in optical interposer development, including silicon photonics, glass/silicon interposer platforms, or wafer-level photonic packaging.
• Familiarity with optical coupling techniques (fiber attach, grating couplers, lens alignment) and low-loss photonic integration processes.
• Demonstrated ability to manage cross-functional development programs with external partners;
• Experience with inline optical metrology, wafer-level testing, yield improvement, and defect reduction.
• Understanding of advanced packaging technologies, including hybrid bonding, chiplet integration, or co-packaged optics, is strongly preferred.
• Excellent communication and problem-solving skills.
• Hands-on approach and ability to thrive in a fast-paced, collaborative setting.

Preferred:

• Experience with silicon photonics manufacturing processes.
• Familiarity with photonic waveguide design, optical I/O, and heterogeneous integration.
• Knowledge of optical and electrical co-design practices for scalable quantum systems.

Benefits and Compensation:

• Work in a pioneering quantum computing company focused on silicon photonics.
• Collaborate with top semiconductor manufacturers and cross-disciplinary teams.
• Opportunities to contribute to the world’s first commercially viable photonic quantum computer.
• Competitive salary and benefits consistent with experience and industry standards.

Other Information:

• PsiQuantum is an equal opportunity employer committed to diversity and inclusion. Applications from underrepresented groups are encouraged.
• PsiQuantum does not solicit resumes through employment agencies;
• Only official PsiQuantum email communications should be trusted. Report suspicious activity to recruiting@psiquantum.com.