Quantum Materials R&D Engineer

Job Descrption

Job Title: Quantum Materials R&D Engineer. Location: Yorktown Heights, New York, USA

Job Type: Entry Level, Full-Time, On-site

Responsibilities:

  • Develop and optimize advanced packaging interconnects, metal thin films, and solder systems to improve device yield, reliability, and performance.
  • Investigate and mitigate materials-related loss mechanisms, including interfacial scattering, grain boundaries, defects, and chemical inhomogeneities.
  • Design and execute experiments using purpose-built test vehicles to evaluate materials behavior and performance.
  • Work with design and process engineering teams to integrate new materials into advanced packaging solutions;
  • Prepare and analyze samples using established best practices and advanced characterization techniques.
  • Perform detailed electrical, structural, and chemical analyses to understand material and interface properties.
  • Apply statistical and analytical methods to extract insights from complex experimental datasets.
  • Develop characterization plans using techniques and tools such as XPS, SIMS, FIB/TEM cross-sections, XRD, and XRF.
  • Identify root causes of materials issues and support process improvements;
  • Identify technical risks and guide material selection decisions.
  • Support the integration of new materials into fabrication processes and device architectures.
  • Contribute technical leadership within multidisciplinary project teams.
  • Mentor junior engineers as needed.
  • Maintain comprehensive records of experimental procedures, process development activities, and test results.
  • Present technical findings, recommendations, and project updates to internal stakeholders and leadership.

Qualifications:

  • Bachelor's degree in Materials Science and Engineering, Chemical Engineering, Chemistry, Physics, or a related field.
  • Candidates must meet one of the following experience and education combinations:
    • Ph.D. in a relevant field.
    • M.S. in a relevant field with 3+ years of relevant industry experience.
    • B.S. in a relevant field with 5+ years of relevant industry experience;
  • Minimum 5 years of experience in the characterization and development of superconductors, metallic thin films, and/or solder systems.
  • Demonstrated expertise in materials characterization and data-driven problem solving.
  • Strong laboratory experience with the ability to independently design and execute experiments.

Preferred:

  • Experience depositing, characterizing, and performing electrical measurements on superconducting materials.
  • Hands-on experience with advanced characterization techniques such as XPS, SIMS, FIB, and TEM.
  • Familiarity with semiconductor fabrication processes and cleanroom environments.
  • Experience working with semiconductor process tools.

Benefits and Compensation:

  • Projected annual salary range of $108,000 to $202,000.
  • Healthcare benefits, including medical, prescription drug, dental, vision, and mental health and well-being coverage.
  • Financial programs including 401(k), cash balance pension plan, employee stock purchase plan, financial counseling, life insurance, and short- and long-term disability coverage.
  • Performance-based salary incentive opportunities;
  • Paid time off including 12 holidays, at least 56 hours of sick time, 120 hours of vacation, and parental bonding leave.
  • Paid family and care leave programs for eligible employees where applicable.
  • Training and educational resources through IBM's AI-driven learning platform.
  • Access to industry-recognized certifications and professional development opportunities;
  • Employee resource groups, volunteer opportunities, and discounts on retail products, services, and experiences.

Other Information:

  • Work Arrangement: Fully on-site in Yorktown Heights, New York.
  • Travel: No travel required.
  • Shift: General daytime.
  • Position Type: Entry Level.
  • Employment Type: Regular.
  • Contract Type: Regular;
  • Visa Sponsorship: IBM will not provide current or future visa sponsorship. Candidates must be able to work in the United States without sponsorship.
  • IBM is an equal opportunity employer and considers qualified applicants in accordance with applicable employment laws.

JOB TYPE

Entry Level

COMPENSATION

$108k - $202k

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