PCB Manufacturing Engineer, Quantum AI

Job Description

Job Title: PCB Manufacturing Engineer, Quantum AI. Location: Goleta, CA, USA

Responsibilities:

• Develop, characterize, document, and scale manufacturing processes for packaging quantum computing devices.
• Design and implement manufacturing, assembly, and test processes for PCB-based electronics, microwave components, and mechanical hardware.
• Apply Design for Manufacturing (DfM) and Design for Test (DfT) practices.
• Operate, maintain, and troubleshoot key manufacturing equipment;
• Lead vendor management activities, including failure analysis, root cause corrective action (RCCA), yield improvement, and workflow optimization.
• Improve internal production processes such as wire bonding, work instructions, fixture/jig design, inspection systems, data handling, automation, and technician training.
• Conduct root cause analysis for manufacturing failures and implement corrective and preventive actions.
• Collaborate with partners to improve lead time, quality performance, and supplier strategy.
• Support continuous improvement initiatives using statistical process control (SPC) and design of experiments (DOE).

Qualifications:

• Bachelor’s degree in Mechanical, Electrical, or Manufacturing Engineering, or equivalent practical experience.
• Minimum 2 years of experience in electronics packaging, including wire bonding, die preparation, or PCBs.
• Minimum 2 years of experience in PCB design, manufacturing, or testing;
• Minimum 2 years of experience managing production processes, including vendor management, process improvement, and monitoring.
• Experience with statistical process control (SPC) and design of experiments (DOE).

Preferred:

• Master’s degree in Mechanical, Electrical, or Manufacturing Engineering or a related field.
• Experience in semiconductor packaging environments.
• Experience handling Electrostatic Discharge (ESD) sensitive devices.
• Experience with automated inspection and testing systems;
• Experience with wire bonding processes such as ball and wedge bonding.
• Knowledge of Six Sigma or other lean manufacturing methodologies.

Benefits and Compensation:

• Base salary range: $132,000–$189,000 per year.
• Additional compensation includes bonus, equity, and benefits.
• Compensation varies based on role, level, location, skills, and experience.
• Access to Google’s comprehensive benefits program (details shared during hiring process).

Other Information:

• Work involves packaging technologies for quantum processors, amplifiers, and devices operating from DC to microwave frequencies in cryogenic environments.
• Role contributes to improving quantum processor performance, qubit environments, and deployment readiness.
• Focus on scaling manufacturing processes and enabling reliable quantum computing systems.
• Google is an equal opportunity employer committed to diversity and inclusion;
• English proficiency is required for global collaboration.
• Google does not accept unsolicited resumes from recruitment agencies.