Chief Packaging Engineer

Job Description

Job Title: Chief Packaging Engineer - 906. Location: Brooklyn Park, MN, USA or Broomfield, CO, USA

Responsibilities:

• Define, develop, and drive advanced packaging architecture for the next generation of ion traps with complex optical, electrical, and mechanical interfaces.
• Lead cross-functional teams developing packaging strategies for large-format ion trap chips with high I/O signal count and density.
• Define and oversee short development loops to determine packaging requirements for mechanical, thermal, electrical, and optical performance.
• Work with external vendors to implement and validate advanced packaging processes;
• Support all stages of ion trap development and ensure compatibility between the ion traps and packaging solutions.
• Provide technical guidance to packaging engineers and collaborate with the broader Quantinuum team to ensure ion trap packaging meets system requirements and is manufacturable.
• Champion third-party engagements to develop key partnerships, supplier relationships, and co-development opportunities.
• Balance technical leadership, hands-on technical contribution, and external vendor partnerships.
• Define and own the packaging technology roadmap for next-generation quantum hardware.

Qualifications:

• Bachelor’s degree with 18+ years of experience in advanced semiconductor packaging development, or
• Master’s degree with 15+ years of experience in advanced semiconductor packaging development, or
• PhD with 12+ years of experience in advanced semiconductor packaging development;
• Due to contractual requirements, candidates must be a U.S. Person, defined as a U.S. citizen, permanent resident or green card holder, or worker granted asylum or refugee status.
• Due to U.S. Government national security requirements, candidates must not be a People's Republic of China national or Russian national unless they are also a U.S. citizen.

Preferred:

• PhD in Physics or Engineering.
• Experience with advanced large-area, multi-chip semiconductor packaging technologies.
• Experience with photonic packaging and fiber-to-chip or optical chip-to-optical chip coupling.
• Experience with large heterogeneous integration and 2.5D/3D packaging techniques.
• Experience with high-density I/O technologies;
• Proven track record of innovation and intellectual property development.
• Experience working within cross-functional teams.
• Broad and deep understanding of microelectronic and photonic packaging techniques for mechanical, thermal, electrical, and photonic interfaces.

Benefits and Compensation:

• Annual compensation: $208,000 to $260,000.
• Compensation range includes the target bonus.
• Actual compensation may vary based on skills, education, professional experience, and other qualifications.
• Competitive compensation for work on advanced quantum computing technology.
• Flexible work arrangements.
• Employer-subsidized medical, dental, and vision insurance.
• 401(k) retirement savings plan with company match;
• Student loan repayment benefit.
• Equity opportunities.
• Generous paid time off and sick leave.
• 12 paid holidays annually.
• Paid parental leave.
• Employee discount programs.

Other Information:

• The position is based in Brooklyn Park, Minnesota, or Broomfield, Colorado.
• The role is hybrid. Employees are expected to work from their assigned location, with the opportunity to work remotely up to 2 days per week with approval.
• Applicants for safety-sensitive positions may be required to complete a pre-employment drug test.
• Applications are accepted on an ongoing basis with no stated application deadline;
• Quantinuum is an equal opportunity employer committed to an inclusive workplace.
• Quantinuum may use AI tools during parts of its recruitment process, including application and resume review. Final hiring decisions are made by humans.
• Reasonable accommodations are available throughout the recruitment and interview process.