Principal Packaging Engineer

Job Description

Job Title: Senior or Principal Packaging Engineer. Location: Redmond, Washington, USA

Job Type: Full-Time (Hybrid, 3 days/week in-office)

Responsibilities:

• Develop, improve, and maintain robust assembly and packaging processes for quantum devices.
• Document packaging processes and implementation standards for global engineering teams.
• Collaborate with external packaging material vendors to develop solutions for quantum hardware.
• Evaluate and qualify packaging suppliers to support manufacturing scale-up;
• Develop and implement testing equipment and evaluation processes for packaging technologies.
• Support the development of advanced packaging solutions for quantum systems.
• Perform or oversee analysis, simulation, and validation of packaging designs.
• Work independently and collaboratively with multidisciplinary engineering teams.
• Contribute to Microsoft's culture of innovation, collaboration, accountability, and inclusion.

Qualifications:

• Master's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related field with at least 5 years of engineering experience.
• OR
• Bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related field with at least 8 years of engineering experience.
• Equivalent professional experience may also be considered.
• Ability to pass Microsoft Cloud Background Check requirements.
• Ability to meet export control and citizenship verification requirements;
• Experience using AI tools to improve engineering workflows, performance analysis, research, and automation.
• Ability to evaluate AI-assisted engineering solutions while following Microsoft's Responsible AI guidelines.

Preferred:

• Experience managing external vendors and suppliers.
• Experience with industry-standard semiconductor chip packaging materials and manufacturing processes.
• Experience working with cryogenic materials;
• Experience with microwave device packaging.
• Experience supporting advanced quantum hardware development.

Benefits and Compensation:

Hardware Engineering IC4

• $119,800 to $234,700 annually (most U.S. locations)
• $160,200 to $261,000 annually (San Francisco Bay Area and New York City)

Hardware Engineering IC5

• $142,800 to $274,800 annually (most U.S. locations)
• $188,000 to $304,200 annually (San Francisco Bay Area and New York City)

Additional compensation and employee benefits may be available depending on role and location.

Other Information:

• Work arrangement: Hybrid (3 days per week in-office)
• Travel requirement: Less than 25%
• Applications will remain open for at least 5 days and will continue to be accepted until the position is filled;
• Microsoft is committed to creating an inclusive workplace that values diversity, collaboration, integrity, accountability, and innovation.
• Candidates must satisfy applicable security screening, export control, and citizenship verification requirements as a condition of employment.