Optical Packaging Process Engineer

Job Description

Job Title: Senior Optical Packaging Process Engineer. Location: Palo Alto, California, United States

Responsibilities:

• Develop, validate, and optimize active alignment processes for high-precision optical components such as fiber arrays.
• Lead process development and qualification for optical module packaging.
• Support New Product Introduction (NPI), including Design for Manufacturability and Design for Reliability, and transition to production.
• Design and execute experiments to improve optical coupling efficiency, mechanical tolerances, and thermal performance.
• Perform root cause analysis of yield and reliability issues and implement corrective actions;
• Develop process documentation including PFMEA, control plans, and work instructions, and train technicians.
• Collaborate with vendors and internal teams to select materials, tools, and automation solutions.
• Participate in equipment selection, installation, and qualification for scaling production;
• Work with external partners and internal stakeholders to improve optical packaging workflows and system performance.
• Develop yield and quality metrics and improve long-term reliability tracking.

Qualifications:

• Master’s degree or higher in Engineering, Physics, or Materials Science.
• 10+ years of experience in semiconductor or photonic packaging environments.
• Strong experience with PIC packaging design, qualification, and multi-chip assemblies.
• 5+ years of experience working with optical fibers and optical measurement systems;
• Experience in OSAT or semiconductor packaging and end-of-line testing environments.
• Experience with fiber array unit (FAU) attachment and chip coupling processes.
• Experience with optical data analysis and yield tracking systems;
• Experience in failure analysis and structured problem-solving methods such as 8D.
• Strong background in yield and quality management systems.

Preferred:

• Experience with advanced semiconductor packaging processes.
• Strong background in photonic integration and optical alignment systems;
• Experience working with automated packaging tools and manufacturing scale-up.
• Familiarity with reliability engineering for photonic systems.

Benefits and Compensation:

• Base salary range: $160,000 to $200,000 depending on location and experience.
• Equity eligibility as part of total compensation package;
• Comprehensive benefits package (medical, dental, vision, and mental health support).
• Opportunity to work on large-scale fault-tolerant quantum computing systems.
• Exposure to silicon photonics-based quantum architecture at industrial scale.