Associate Quantum Hardware Assembly R&D Engineer

Job Description

Job Title: Associate Quantum Hardware Assembly R&D Engineer. Location: Yorktown Heights, New York, USA

Job Type: Entry Level, Full-Time, On-site

Responsibilities:

• Support the research, development, fabrication, and characterization of advanced electronic packaging technologies for quantum hardware.
• Develop and optimize assembly processes for next-generation quantum devices, including surface mount technology (SMT), die attach, flip-chip assembly, and related packaging techniques;
• Evaluate assembly yields, process capability, and package performance through electrical, mechanical, and physical characterization methods.
• Support hardware integration, process troubleshooting, and root-cause investigations to resolve assembly and packaging-related issues.
• Document experimental methods, results, and recommendations through technical reports, presentations, and formal documentation.
• Collaborate with multidisciplinary teams across IBM Quantum, including electrical engineers, fabrication engineers, materials scientists, and experimental physicists.
• Support hardware development, integration, and technology maturation efforts;
• Work with state-of-the-art assembly and characterization tools to develop new hardware, processes, and packaging technologies for superconducting qubit systems.
• Independently troubleshoot and solve complex technical problems.
• Continuously learn and develop new technical skills in quantum hardware assembly and packaging.

Qualifications:

• Bachelor’s degree in Materials Science and Engineering, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field.
• Ability to independently troubleshoot and solve complex technical problems.
• Ability to work effectively with interdisciplinary teams.
• Strong attention to detail and commitment to high-quality work;
• Strong growth mindset and willingness to continuously learn and develop new skills.
• Ability to collaborate effectively with electrical engineers, fabrication engineers, materials scientists, and experimental physicists.
• Prior quantum hardware experience is not required.

Preferred:

• Academic, internship, or research experience involving materials development, characterization, or process engineering.
• Hands-on experience with electronic packaging and assembly techniques, including die attach, flip-chip assembly, surface mount technology (SMT), soldering, or related processes;
• Experience with optical microscopy, scanning electron microscopy (SEM), cross-sectioning, metrology, and basic electrical testing.
• Familiarity with process development, statistical process control (SPC), yield analysis, or design-of-experiments (DOE) methodologies.

Benefits and Compensation:

• Projected annual salary range of $85,000 to $160,000.
• Comprehensive healthcare benefits, including medical, prescription drug, dental, vision, and mental health and well-being coverage.
• Financial programs including 401(k), cash balance pension plan, IBM Employee Stock Purchase Plan, financial counseling, life insurance, short-term and long-term disability coverage, and performance-based salary incentive opportunities where eligible.
• Paid time off including 12 holidays, a minimum of 56 hours of sick time, 120 hours of vacation, 12 weeks of parental bonding leave, and other paid care leave programs;
• Training and educational resources through IBM's personalized, AI-driven learning platform.
• Opportunities to earn industry-recognized certifications and develop new skills.
• Access to employee resource groups, giving and volunteer opportunities, and discounts on retail products, services, and experiences.

Other Information:

• Work Arrangement: Fully on-site.
• Employment Type: Regular.
• Travel: No travel required.
• Shift: General daytime.
• Position Type: Entry Level.
• Salary: $85,000 to $160,000 per year.
• Job ID: 130456.
• Date Posted: August 28, 2026;
• IBM will not provide visa sponsorship for this position now or in the future. Candidates must be able to work in the United States without current or future visa sponsorship.
• Compensation and benefits are based on a full-time schedule for a full calendar year and may be adjusted or prorated for part-time employees or employees who begin during the calendar year.
• IBM is an equal-opportunity employer committed to maintaining a diverse and inclusive workplace.