Packaging Engineer (Quantum Hardware)

Job Description

Job Title: Packaging Engineer – Quantum Hardware. Location: Yorktown Heights, NY

Responsibilities:

• Lead first- and second-level quantum processor packaging designs from concept through execution.
• Perform physical design of laminates and PCBs using industry-standard tools (e.g., Cadence Allegro, Altium Designer, Mentor Expedition).
• Translate high-level system requirements into detailed low-level hardware design;
• Conduct simulations and validations for thermal and electromagnetic performance (signal integrity, power integrity);
• Collaborate with chip design and system integration teams to define I/O interfaces and improve packaging reliability.

Qualifications:

• Master’s degree in Electrical Engineering, Mechanical Engineering, or a related field;
• Experience with PCB/laminate layout tools (Cadence Allegro/APD, Altium Designer, Siemens Xpedition).
• Strong understanding of fabrication DFM cycles and mechanical/thermal engineering for microelectronics.
• Excellent communication, documentation, and collaborative skills.

Preferred:

• Experience with electromagnetic (EM) simulation and thermal simulation tools.
• Familiarity with hardware system-level interconnects for quantum or high-performance computing systems.

Benefits:

• Healthcare: Medical, dental, vision, and mental health coverage.
• Financial: 401(k), stock purchase plan, performance-based incentives, and insurance coverage.
• Time Off: Generous PTO including holidays, sick leave, and paid parental bonding leave;
• Learning & Development: Access to IBM’s AI-driven learning platform for certifications and professional growth.
• Inclusion: Diverse employee resource groups and volunteer/giving opportunities.

Instructions:

To apply, submit your application through IBM’s career portal. Qualified applicants with criminal histories will be considered in accordance with applicable law. IBM is an equal-opportunity employer.